Mat-Tech Development & Testing

Knowledge Centre

Mat-Tech closely follows international developments in the field of high-tech brazing. Mat-Tech Development & Testing Department has access to new and fundamental research in the field, and is also actively involved in a number of international projects. The knowledge that Mat-Tech acquires is shared with our clients, industry peers and other parties where there is a common ground in high-tech brazing. We are actively sharing our knowledge at fairs, seminars and on this platform as well as other media. Some of the projects Mat-Tech are involved in are as follows:

Residueless Soldering with Bi-In

Thermo-mechanical stresses that built up from cool-down after soldering will affect the overall longevity performance of such devices. To mitigate this negative effect, soldering temperature has to be kept as low as possible. Read how this can be done.

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The Young-Laplace Equation

The shape of a liquid drop is governed by what is known as the Young-LaPlace equation. It was derived more or less simultaneously by Thomas Young (1804) and Simon Pierre de Laplace (1805). Read here how they did it.

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Young’s Law

The relation between surface tension and contact angles as a measure for the wetting capability is due to Thomas Young (1804). A short derivation is given here.

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Brazing of Aluminium Alloys with Higher Magnesium Content

One can braze the higher Mg-content heat-treatable AA-6082 series Al alloys, (containing Mg, Si, Fe, Mn, Cr, Zn, Ti), with a near-eutectic Al-Si filler metal using non-corrosive fluxes.

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Diffusion Bonding and Brazing in 3D

This combination of technologies is essential in designing various plate and shell-type heat-exchangers. Application is shown in the joining of two-phase (α+β) Ti-6Al-4V (ASTM Grade 5) alloy parts.

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TLPB of Tungsten to Copper-Based Precipitation-Hardened Alloys

Transient Liquid Phase Bonding is applied well below the aging temperature (450-480˚C) of the CuCrZr-alloy, whereas the resulting joints will be capable of service at elevated temperatures.

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The Stiffness of a Vertically Loaded Liquid Bump

The stand-off of a flip-chip is governed by the equilibrium between the weight of the chip and the counteracting spring formed by the surface tension of the liquid bump.

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Ultimate: Soldering Aluminium at Low Temperature

Ultra-low melting leadfree solder compositions can be used for stress reduction in joints in a bio-ambient or temperature sensitive environment.

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SALT I: Soldering Aluminium at Low Temperatureat

Certain Aluminium alloys can be successfully soldered using low melting solders. Read here how we do it.

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SALT II: Soldering Aluminium at Low Temperature

For tracking of assets, low-cost interconnect technologies are required. This can be achieved through a low melting lead-free matrix with chemical additives.

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Stress Reduction by Design for Ball Grid Array

In case one assumes that the bump is built from shearing discs, a simple model of a deflected bump can be made.

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The Molar Specific Heat of Metals

In 1819 Pierre Louis Dulong and Alexis Thérèse Petit found that the specific molar heat for metals is approximately 3 R @ 25 J/K. Here R is the gas constant.

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Joining of High Purity Copper for Compact Linear Collider Structure

The material of CLIC accelerating structure disks is high conductivity Oxygen-free-electronic Cu. Fabrication of the CLIC disk stack occurs through diffusion bonding.

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Solder as Alternative Joining Material for Solar Panel Assembly

Soldering with low-temperature Pb-free alloys is a viable replacement for conductive adhesives in back-contacted solar panels.

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European project CSI: Central Nervous System Imaging

Diseases affecting the brain and the central nervous system (Alzheimer’s, Parkinson’s) are among those with the greatest impact on our society.

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The limitations of Self-Alignment

Minimization of surface energy is the driving force for self-alignment. This phenomenon can be used to line-up electronic components.

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Mat tech

Non-Linear Spring Model for Solid Material

The properties of a solid material as yield strength, modulus and linear coefficient of thermal expansion CTE are intimately related.

The Restoring Forces in a Distorted Ball Bump

Distortion of a liquid bump leads automatically to an increase in surface energy. Using an elliptical model, restoring forces can be well-estimated.

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