Ultimate: Soldering Aluminium at Low Temperature
Ultra-low melting leadfree solder compositions can be used for stress reduction in joints in a bio-ambient or temperature sensitive environment. I. Challenges and objectives To design, alloy and process low melting leadfree solder compositions for the purpose of reducing stresses in solder joints to be used in a bio ambient or temperature sensitive environment. II. […]
SALT I: Soldering Aluminium at Low Temperatureat
Certain Aluminium alloys can be successfully soldered using low melting solders. Read here how we do it. I. Challenges and objectives Joining of Aluminium and its alloys represents a specific challenge due to the presence of the tenacious oxide film at the metal surface. Successful joining of any Aluminium alloy requires a surface modification action, […]
SALT II: Soldering Aluminium at Low Temperature
For tracking of assets, low-cost interconnect technologies are required. This can be achieved through a low melting lead-free matrix with chemical additives. I. Introduction Tracking of assets and personnel, either for security or for efficient managing of resources, is a significant problem in today’s business environment. Theft, losses, misplacement of assets results in billions of […]
Stress Reduction by Design for Ball Grid Array
In case one assumes that the bump is built from shearing discs, a simple model of a deflected bump can be made. I. Introduction BGAs or Ball Grid Arrays are characterized through their large array of solder ball based interconnects at the bottom side of the components. The solder joint serves both as electrical interconnect […]
The Molar Specific Heat of Metals
In 1819 Pierre Louis Dulong and Alexis Thérèse Petit found that the specific molar heat for metals is approximately 3 R @ 25 J/K. Here R is the gas constant. I. Introduction Already in 1819 Pierre Louis Dulong and Alexis Thérèse Petit found that the specific molar heat for metals is nearly a constant. The […]
Joining of High Purity Copper for Compact Linear Collider Structure
The material of CLIC accelerating structure disks is high conductivity Oxygen-free-electronic Cu. Fabrication of the CLIC disk stack occurs through diffusion bonding. I. Introduction The CLIC project designs and builds the next generation particle accelerator. The present material of CLIC accelerating structure disks (cells) is high conductivity Oxygenelectronic(OFE) Cu (fig. 1). Current technology for fabricating […]
Solder as Alternative Joining Material for Solar Panel Assembly
Soldering with low-temperature Pb-free alloys is a viable replacement for conductive adhesives in back-contacted solar panels. I. Introduction In the quest for replacements for the Ag-filled conductive adhesives in the solar panel fabrication, soldering with low-temperature Pb-free alloys is a viable option. Joining of through vias interconnects of Si-based individual cells will be performed via […]
