Stress Reduction by Design for Ball Grid Array

In case one assumes that the bump is built from shearing discs, a simple model of a deflected bump can be made. I. Introduction BGAs or Ball Grid Arrays are characterized through their large array of solder ball based interconnects at the bottom side of the components. The solder joint serves both as electrical interconnect […]

The Molar Specific Heat of Metals

In 1819 Pierre Louis Dulong and Alexis Thérèse Petit found that the specific molar heat for metals is approximately 3 R @ 25 J/K. Here R is the gas constant. I. Introduction Already in 1819 Pierre Louis Dulong and Alexis Thérèse Petit found that the specific molar heat for metals is nearly a constant. The […]

Joining of High Purity Copper for Compact Linear Collider Structure

The material of CLIC accelerating structure disks is high conductivity Oxygen-free-electronic Cu. Fabrication of the CLIC disk stack occurs through diffusion bonding. I. Introduction The CLIC project designs and builds the next generation particle accelerator. The present material of CLIC accelerating structure disks (cells) is high conductivity Oxygenelectronic(OFE) Cu (fig. 1). Current technology for fabricating […]

Solder as Alternative Joining Material for Solar Panel Assembly

Soldering with low-temperature Pb-free alloys is a viable replacement for conductive adhesives in back-contacted solar panels. I. Introduction In the quest for replacements for the Ag-filled conductive adhesives in the solar panel fabrication, soldering with low-temperature Pb-free alloys is a viable option. Joining of through vias interconnects of Si-based individual cells will be performed via […]