Residueless Soldering with Bi-In

Thermo-mechanical stresses that built up from cool-down after soldering will affect the overall longevity performance of such devices. To mitigate this negative effect, soldering temperature has to be kept as low as possible. Read how this can be done.Residueless Soldering with Bi-In I. Introduction Soldering of highly stress-sensitive electronic devices (e.g. infrared detectors, photodiodes, Si-based […]

The Young-Laplace Equation

The shape of a liquid drop is governed by what is known as the Young-LaPlace equation. It was derived more or less simultaneously by Thomas Young (1804) and Simon Pierre de Laplace (1805). Read here how they did it. I. Introduction The shape of liquid drop is governed by what is known as the Young-LaPlace […]

Young’s Law

The relation between surface tension and contact angles as a measure for the wetting capability is due to Thomas Young (1804). A short derivation is given here. I. Introduction The concept of surface tension and contact angles as a measure for the wetting capability is ascribed to Thomas Young (1804). This led to what we […]

Brazing of Aluminium Alloys with Higher Magnesium Content

One can braze the higher Mg-content heat-treatable AA-6082 series Al alloys, (containing Mg, Si, Fe, Mn, Cr, Zn, Ti), with a near-eutectic Al-Si filler metal using non-corrosive fluxes. I. Introduction Successful brazing of any Al alloy requires prior removal of the native surface oxide film, which is usually done by employing a flux. The flux […]

Diffusion Bonding and Brazing in 3D

This combination of technologies is essential in designing various plate and shell-type heat-exchangers. Application is shown in the joining of two-phase (α+β) Ti-6Al-4V (ASTM Grade 5) alloy parts. I. Introduction Although traditional machining methods of Titanium alloys can generate rather intricate contours and complex shaped parts, fabrication of three-dimensional (3D) components can often be limited […]

TLPB of Tungsten to Copper-Based Precipitation-Hardened Alloys

Transient Liquid Phase Bonding is applied well below the aging temperature (450-480˚C) of the CuCrZr-alloy, whereas the resulting joints will be capable of service at elevated temperatures. I. Introduction Within the International Thermonuclear Experimental Reactor (ITER), one of the most challenging components is the divertor, whose main function is to extract the power from the […]

The Stiffness of a Vertically Loaded Liquid Bump

The stand-off of a flip-chip is governed by the equilibrium between the weight of the chip and the counteracting spring formed by the surface tension of the liquid bump. I. Introduction In a soldering process the assemblies seeks to minimize the amount of free energy. The weight of the chip compresses the spring formed by […]

Ultimate: Soldering Aluminium at Low Temperature

Ultra-low melting leadfree solder compositions can be used for stress reduction in joints in a bio-ambient or temperature sensitive environment. I. Challenges and objectives To design, alloy and process low melting leadfree solder compositions for the purpose of reducing stresses in solder joints to be used in a bio ambient or temperature sensitive environment. II. […]

SALT I: Soldering Aluminium at Low Temperatureat

Certain Aluminium alloys can be successfully soldered using low melting solders. Read here how we do it. I. Challenges and objectives Joining of Aluminium and its alloys represents a specific challenge due to the presence of the tenacious oxide film at the metal surface. Successful joining of any Aluminium alloy requires a surface modification action, […]

SALT II: Soldering Aluminium at Low Temperature

For tracking of assets, low-cost interconnect technologies are required. This can be achieved through a low melting lead-free matrix with chemical additives. I. Introduction Tracking of assets and personnel, either for security or for efficient managing of resources, is a significant problem in today’s business environment. Theft, losses, misplacement of assets results in billions of […]