In 1819 Pierre Louis Dulong and Alexis Thérèse Petit found that the specific molar heat for metals is approximately 3 R @ 25 J/K. Here

The material of CLIC accelerating structure disks is high conductivity Oxygen-free-electronic Cu. Fabrication of the CLIC disk stack occurs through diffusion bonding. I. Introduction The

Soldering with low-temperature Pb-free alloys is a viable replacement for conductive adhesives in back-contacted solar panels. I. Introduction In the quest for replacements for the