Transient Liquid Phase Bonding is applied well below the aging temperature (450-480˚C) of the CuCrZr-alloy, whereas the resulting joints will be capable of service at

The stand-off of a flip-chip is governed by the equilibrium between the weight of the chip and the counteracting spring formed by the surface tension

Ultra-low melting leadfree solder compositions can be used for stress reduction in joints in a bio-ambient or temperature sensitive environment. I. Challenges and objectives To

Certain Aluminium alloys can be successfully soldered using low melting solders. Read here how we do it. I. Challenges and objectives Joining of Aluminium and

For tracking of assets, low-cost interconnect technologies are required. This can be achieved through a low melting lead-free matrix with chemical additives. I. Introduction Tracking

In case one assumes that the bump is built from shearing discs, a simple model of a deflected bump can be made. I. Introduction BGAs