Energy-Dispersive X-ray Spectroscopy (EDX)
In order to analyze the composition of the surface of components precisely, Mat-Tech utilizes Energy-Dispersive X-ray Spectroscopy (EDX). This is a surface analysis technique where an electron beam (emitting specific wavelengths of X-rays) strikes the component, thereby exciting an electron in an inner shell. This results in an electron hole in the electronic structure of the element.
The energy of the electron beam ranges from 10-20 keV. The amount of energy emitted in the form of X-rays depends on the element. The electron beam moves across the component, and the images are stored. The presence of Au, Ag, and Pd on the NP surface can be easily identified. However, elements with low atomic numbers are challenging to detect with EDX.
EDX can be used with very small components, even as small as a few cubic micrometers in size.
Articles
Diffusion Bonding in 3D-Manufacturing of Titanium Alloy Structures
I. Introduction II. Specification of the industrial problem Fig. 1: Optical images (“top view”) of the initial Ti-6Al-4V alloy parts. III. Direct low-pressure diffusion bonding
Brazing of Aluminium Alloys with High-Magnesium content
ABSTRACT Successful brazing of any Aluminium alloy requires prior removal of the native surface oxide film,which is usually done by employing a flux. Magnesium additions
Brazing of refractory metals and AISI 304 stainless steel to Copper – The use of
ABSTRACT Brazing of several refractory metals, namely, Tungsten, Molybdenum and Niobium as wellas austenitic stainless steel AISI 304 to pure Copper was performed in vacuum
Joining of Zirconia Ceramics to AISI 316L Stainless Steel
I. Specification of the problem The present Project is dealing with the fabrication of electrical (high-voltage) feedthrough consisting of YSZ (ZrO2 + 3 % mole
Brazing of Aluminium Oxide Ceramics is an important step in manufacturing of the CO2-cooled substrate
I. Introduction Aluminium Oxide Ceramics due primarily to its good heat conductivity (of about 30 W×m-1×K-1) and a relatively low cost is considered as an
High-temperature soldering of P- and N-Legs to the Copper connector in thermoelectric convertor assembling
I. Introduction Our previous investigation of the interfacial regions in the ”(p-n) thermocouple” / Cu- connector assembly (Project No. 2012-3067-0616) was aimed at providing a
