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Residueless Soldering with Bi-In

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The Young-Laplace Equation

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Young’s Equation

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Brazing of Aluminium Alloys with Higher Magnesium Content

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Diffusion Bonding and Brazing in 3D

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TLPB of Tungsten to Copper-Based Precipitation-Hardened Alloys

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The Stiffness of a Vertically Loaded Liquid Bump

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Ultimate: Soldering Aluminium at Low Temperature

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SALT I: Soldering Aluminium at Low Temperatureat

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SALT II: Soldering Aluminium at Low Temperature

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Stress Reduction by Design for Ball Grid Array

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The Molar Specific Heat of Metals

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Joining of High Purity Copper for Compact Linear Collider Structure

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Solder as Alternative Joining Material for Solar Panel Assembly

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European project CSI: Central Nervous System Imaging

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The Limitations of Self-Alignment

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A Non-Linear Spring Model for Solid Material

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The Restoring Forces in a Distorted Ball Bump

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