Mat-Tech closely follows international developments in the field of high-tech brazing. Mat-Tech Development & Testing Department has access to new and fundamental research in the field, and is also actively involved in a number of international projects. The knowledge that Mat-Tech acquires is shared with our clients, industry peers and other parties where there is a common ground in high-tech brazing. We are actively sharing our knowledge at fairs, seminars and on this platform as well as other media. Some of the projects Mat-Tech are involved in are as follows:
Soldering with low-temperature Pb-free alloys is a viable replacement for conductive adhesives in back-contacted solar panels.
The material of CLIC accelerating structure disks is high conductivity Oxygen-free-electronic Cu. Fabrication of the CLIC disk stack occurs through diffusion bonding. I. Introduction The CLIC project designs and builds the next generation particle accelerator. The present material of CLIC accelerating structure disks (cells) is high conductivity Oxygenelectronic(OFE) Cu (fig. 1). Current technology for fabricating […]
In 1819 Pierre Louis Dulong and Alexis Thérèse Petit found that the specific molar heat for metals is approximately 3 R @ 25 J/K. Here R is the gas constant.
In case one assumes that the bump is built from shearing discs, a simple model of a deflected bump can be made. I. Introduction BGAs or Ball Grid Arrays are characterized through their large array of solder ball based interconnects at the bottom side of the components. The solder joint serves both as electrical interconnect […]
For tracking of assets, low-cost interconnect technologies are required. This can be achieved through a low melting lead-free matrix with chemical additives. I. Introduction Tracking of assets and personnel, either for security or for efficient managing of resources, is a significant problem in today’s business environment. Theft, losses, misplacement of assets results in billions of […]
Certain Aluminium alloys can be successfully soldered using low melting solders. Read here how we do it.
Ultra-low melting leadfree solder compositions can be used for stress reduction in joints in a bio-ambient or temperature sensitive environment.
The stand-off of a flip-chip is governed by the equilibrium between the weight of the chip and the counteracting spring formed by the surface tension of the liquid bump.
Transient Liquid Phase Bonding is applied well below the aging temperature (450-480˚C) of the CuCrZr-alloy, whereas the resulting joints will be capable of service at elevated temperatures.
This combination of technologies is essential in designing various plate and shell-type heat-exchangers. Application is shown in the joining of two-phase (α+β) Ti-6Al-4V (ASTM Grade 5) alloy parts.
One can braze the higher Mg-content heat-treatable AA-6082 series Al alloys, (containing Mg, Si, Fe, Mn, Cr, Zn, Ti), with a near-eutectic Al-Si filler metal using non-corrosive fluxes. I. Introduction Successful brazing of any Al alloy requires prior removal of the native surface oxide film, which is usually done by employing a flux. The flux […]
The relation between surface tension and contact angles as a measure for the wetting capability is due to Thomas Young (1804). A short derivation is given here. I. Introduction The concept of surface tension and contact angles as a measure for the wetting capability is ascribed to Thomas Young (1804). This led to what we […]
The shape of a liquid drop is governed by what is known as the Young-LaPlace equation. It was derived more or less simultaneously by Thomas Young (1804) and Simon Pierre de Laplace (1805). Read here how they did it.
Thermo-mechanical stresses that built up from cool-down after soldering will affect the overall longevity performance of such devices. To mitigate this negative effect, soldering temperature has to be kept as low as possible. Read how this can be done.