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Residueless Soldering with Bi-In
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The Young-Laplace Equation
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Young’s Equation
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Brazing of Aluminium Alloys with Higher Magnesium Content
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Diffusion Bonding and Brazing in 3D
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TLPB of Tungsten to Copper-Based Precipitation-Hardened Alloys
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The Stiffness of a Vertically Loaded Liquid Bump
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Ultimate: Soldering Aluminium at Low Temperature
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SALT I: Soldering Aluminium at Low Temperatureat
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SALT II: Soldering Aluminium at Low Temperature
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Stress Reduction by Design for Ball Grid Array
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The Molar Specific Heat of Metals
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Joining of High Purity Copper for Compact Linear Collider Structure
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Solder as Alternative Joining Material for Solar Panel Assembly
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European project CSI: Central Nervous System Imaging
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The Limitations of Self-Alignment
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A Non-Linear Spring Model for Solid Material
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The Restoring Forces in a Distorted Ball Bump
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