Knowledge Centre
Mat-Tech closely follows international developments in the field of high-tech brazing. Mat-Tech Development & Testing Department has access to new and fundamental research in the field, and is also actively involved in a number of international projects. The knowledge that Mat-Tech acquires is shared with our clients, industry peers and other parties where there is a common ground in high-tech brazing. We are actively sharing our knowledge at fairs, seminars and on this platform as well as other media. Some of the projects Mat-Tech are involved in are as follows:
TLPB of Tungsten to Copper-Based Precipitation-Hardened Alloys
Transient Liquid Phase Bonding is applied well below the aging temperature (450-480ËšC) of the CuCrZr-alloy, whereas the resulting joints will be capable of service at
The Stiffness of a Vertically Loaded Liquid Bump
The stand-off of a flip-chip is governed by the equilibrium between the weight of the chip and the counteracting spring formed by the surface tension
Ultimate: Soldering Aluminium at Low Temperature
Ultra-low melting leadfree solder compositions can be used for stress reduction in joints in a bio-ambient or temperature sensitive environment. I. Challenges and objectives To
SALT I: Soldering Aluminium at Low Temperatureat
Certain Aluminium alloys can be successfully soldered using low melting solders. Read here how we do it. I. Challenges and objectives Joining of Aluminium and
SALT II: Soldering Aluminium at Low Temperature
For tracking of assets, low-cost interconnect technologies are required. This can be achieved through a low melting lead-free matrix with chemical additives. I. Introduction Tracking
Stress Reduction by Design for Ball Grid Array
In case one assumes that the bump is built from shearing discs, a simple model of a deflected bump can be made. I. Introduction BGAs
